Industrial Research
- HIPIMS power supply development for cathode and substrate bias – project partner Huettinger Electronic Sp. z o.o., Warsaw Poland (pdf) image caption: Commercial grade HIPIMS power supply 8MW / 20 kW
- Technology for deposition in high aspect ratio vias for TSV applications using HIPIMS – process development, upscaling with OC Oerlikon Balzers Ltd., Liechtenstein. Product introduced to market by OC Oerlikon. (pdf - Weichart SVC09_201.pdf) image caption: 200 mm Si wafer
- Technology for HIPIMS deposition of cryogenic materials – Er, ErNi – to be used in satellite cryocoolers – project partner Rutherford Appleton Laboratory, UK. image caption: stainless steel mesh coated with Er
- Deposition of solar cell absorber layers – Cu(InGa)Se2 with DayStar Inc. USA
